穆德魁
电子邮箱：mudk@安博体育.安博体育.edu.cn
研究领域主要集中在金刚石与金属、金属与金属的液/固和固/固界面反应机制与调控机理研究，相关研究涉及金刚石钎焊用焊料合金成分设计、精密磨削用金刚石工具制备和加工评价、高硬度（碳化硅、金刚石、蓝宝石等）大尺寸晶圆高效精密磨削与去除机理、金刚石固态界面微观组织调控与热管理、先进封装材料评价与开发等方面。
课题组所在团队经费充足，长期招收材料、机械、材料物理化学等背景的硕、博研究生和博士后，欢迎有志从事半导体材料加工相关研究的同学报考！
基本信息
通讯电话：15759211638
电子邮箱：mudk@安博体育.安博体育.edu.cn
通讯地址：广东省深圳市光明安博体育66号中山大学理学园-东503
教育背景
2009/03-2013/03：昆士兰大学，博士
2006/05-2009/03：昆士兰科技大学，硕士
2004/07-2006/03：昆士兰科技大学，学士
工作经历
2012/11-2013/11：昆士兰大学，博士后
2014/02-2014/05：斯培利亚（日本），研发工程师
2014/09-2015/09：江苏科技大学，讲师
2015/10-2020/12：华侨大学，副教授，硕士生导师
2020/12-2024/11：华侨大学，教授(破格晋升)，博士生导师
2024/11-至今： 中山大学，教授，博士生导师
主讲课程
机械制造装备设计,本科生课程
科研项目
1.河南省重点研发专项子课题：半导体晶圆切割用精密超薄金刚石砂轮关键技术开发及应用，主持，在研。
2.通用（中国）横向课题：低温纳米银浆开发与评测研究，主持，结题。
3.福建省中央引导地方科技发展项目：晶圆级封装芯片切割用金刚石超薄砂轮制备与评价关键技术研究，主持，结题。
4.国家自然科学基金面上项目：活性软钎料低温连接金刚石磨粒关键技术的基础研究，主持，结题。
5.福建省科技厅引导性项目：钎焊金刚石用异质增强低温焊料的开发研究，主持，结题。
6.厦门市科技局产学研协同创新项目：钎焊微粉金刚石砂轮制备工艺，主持，结题。
7.华侨大学中青年教师科技创新资助计划(优秀青年科技创新人才)，主持，结题。
8.河南省重大科技专项：高导热与高透光功能金刚石材料制备关键技术研究及应用，参与，结题。
9.国家自然科学基金联合基金重点项目:复杂形状石材制品省材高效加工关键技术基础研究，参与，结题。
10.先进结构与复合材料国家重点研发计划：磨削类超硬材料制品增材制造工艺及应用示范，参与，在研。
研究领域
界面反应；微观组织；金刚石工具；精密磨削
学术兼职
国家自然科学基金以及科技部、福建省、河南省、江西省等科技项目评审专家；JOM (2024-2025)，Metals等期刊客座编辑；Nature Communication等二十余个国际期刊审稿人；
荣誉奖项
1.福建省高层次引进人才境外B类
2.福建省优秀硕士论文指导教师
3.第九届中国国际“互联网+”大学生创新创业大赛国家银奖
4.第七、八、九届中国国际“互联网+”大学生创新创业大赛福建省金奖
5.第十四届“挑战杯”中国大学生创业计划竞赛福建省金奖
6.福建省技术发明一等奖（第四）
7.QUT Postgraduate Research Award (QUTPRA)
8.Australian Postgraduate Award (APA) with Top-up from Nihon Superior Centre for the Manufacture of Electronic Materials
9.UQ Graduate School International Travel Award (GSITA)
期刊论文
1.Mian Li, Dekui Mu*, Yueqin Wu, Guoqing Huang, Hui Meng, Xipeng Xu, Han Huang: Influence of diamond abrasives on material removal of single crystal SiC in mechanical dicing，Journal of Materials Process and Technology, 327 (2024) 118390.
2.Mian Li, Jiawei Liu, Xipeng Xu, Dekui Mu*: Influence of sintering temperature on dicing performances of metal-bonded diamond blades on sapphire, Journal of Materials Research and Technology, 29 (2024) 991-999.
3.Shuangyng Zou, Changcheng Zheng, Dekui Mu*: Microstructure and Bonding Strength of Low-Temperature Sintered Ag/Nano-Ag Films/Ag Joints, Metals, 13 (2023), 1833.
4.Zhuo Liu; Wei Cheng; Dekui Mu*; Yueqin Wu, Qiaoli Lin; Xipeng Xu, Han Huang: Influences of early-stage C diffusion on growth microstructures in solid-state interface reaction between CVD diamond and sputtered Cr, Materials Characterization, 196(2023) 112603.
5.Mian Li, Dekui Mu*, Shuiquan Huang, Hui Meng, Xipeng Xu, Han Huang: Ultrathin diamond blades for dicing single crystal SiC developed using a novel bonding method, Journal of Manufacturing Processes, 84(2022)88-99.
6.Zhuo Liu; Wei Cheng; Dekui Mu*; Qiaoli Lin; Xipeng Xu; Han Huang: Growth mechanisms of interfacial carbides in solid-state reaction between single-crystal diamond and chromium, Journal of Materials Science & Technology, 144(2022)138-149.
7.Xinjiang Liao, Zhuo Liu, Ruixiang Liu, Dekui Mu*: Microstructure evolution and joining strength of diamond brazed on Ti-6Al-4V substrates using Ti-free eutectic Ag-Cu filler alloy, Diamond and Related materials, 127(2022)109198.
8.Wie Cheng, Zhuo Liu, Qiaoli Lin, Guoqing Huang, Dekui Mu*, Han Huang, Xipeng Xu: Towards Tailorable Interface Microstructure through Solid-state Interface Reaction between Synthetic Diamond Grits and Sputtered Ni-Cr Binary Alloy, Applied Surface Science, 596(4988)153531.
9.Zhuo Liu, Xinjiang Liao, Wei Fu, Dekui Mu*, Xipeng Xu, Han Huang: Microstructures and Bonding Strength of Synthetic Diamond Brazed by Near-Eutectic Ag-Cu-In-Ti Filler Alloy, Materials Science & Engineering A, 790 (2020) 139711.
10.Yubin, Zhang, Xinjiang Liao, Qiaoli Lin, Dekui Mu*, Jing Lu, Hui Huang, Han Huang: Reactive Infiltration and Microstructural Characteristics of Sn-V Active Solder Alloys on Porous Graphite, Materials 13 (2020) 1532.
11.Xinjiang Liao, Qiqi He, Qiaoli Lin, Dekui Mu*: Reactive wetting of Sn-V solder alloys on polycrystalline CVD diamond, Applied Surface Science 504 (2020) 144508.
12.Xinjiang Liao, Dekui Mu*, Wei Fu, Hui Huang, Han Huang: Low-temperature wetting mechanisms of polycrystalline chemical vapour deposition (CVD) diamond by Sn-Ti solder alloys, Materials & Design, 182 (2019) 108039.
13.Mian Li, Jinchang Chen, Qiaoli Lin, Yueqin Wu, Dekui Mu*: Interfacial microstructures and mechanical integrity of synthetic diamond brazed by a low-temperature Cu-Sn-Cr filler alloy, Diamond and Related Materials, 97 (2019) 107440.
14.Jinchang Chen, Xinjiang Liao, Qiaoli Lin, Dekui Mu*, Hui Huang, Xipeng Xu. Han Huang: Reactive wetting of binary Sn Cr alloy on polycrystalline chemical vapour deposited diamond at relatively low temperatures, Diamond and Related Materials, 92 (2019) 92-99.
15.Jinchang Chen, Dekui Mu*, Xinjiang Liao, Guoqin Huang, Hui Huang, Xipeng Xu, Han Huang: Interfacial microstructure and mechanical properties of synthetic diamond brazed by Ni-Cr-P filler alloy. International Journal of Refractory Metals and Hard Materials, 74 (2018) 52-60.
16.Xinjiang Liao, Dekui Mu*, Jianxin Wang, Guoqin Huang, Hui Huang, Xipeng Xu, Han Huang: Formation of TiC via interface reaction between diamond grits and Sn-Ti alloys at relatively low temperatures, International. Journal of Refractory Metals & Hard Materials, 66 (2017) 252-257.
17.Dekui. Mu*, Kuiyuan Feng, Qiaoli Lin, Han Huang: Low-temperature wetting of sapphire using Sn–Ti active solder alloys, Ceramics International, 45 (2019) 22175–22182.
18.Dekui Mu, Stuart D. McDonald, Jonathan Read, Han Huang and Kazuhiro Nogta: Critical Properties of Cu6Sn5 in Electronic Devices: Recent Progress and A Review. Current Opinion in Solid State & Materials Science. 20, (2016) 55-76.
19.Dekui Mu, Han Huang, Stuart D. McDonald, Jonathan Read and Kazuhiro Nogita: Investigating the Mechanical Properties, Creep and Crack Pattern of Cu6Sn5 and (Cu,Ni)6Sn5 on Diverse Crystal Planes. Material Science and Engineering A, 566, 126 (2013).
20.Dekui Mu, Han Huang, Stuart D. McDonald and Kazuhiro Nogita: Creep and Mechanical Properties of Cu6Sn5 and (Cu,Ni)6Sn5 at Elevated Temperatures. Journal of Electronic Materials, 42, 304 (2013).
21.Dekui Mu*, H. Yasuda, H. Huang and K. Nogita: Growth orientation and mechanical properties of Cu6Sn5 and (Cu,Ni)6Sn5 on poly-crystalline Cu. Journal of Alloys and Compounds, 536, 39 (2012).
22.Dekui Mu, H. Huang and K. Nogita: Anisotropic mechanical properties of Cu6Sn5 and (Cu,Ni)6Sn5, Materials Letters, 86, 46 (2012).
23.Dekui Mu*, Jonathan Read, Yafeng Yang and Kazuhiro Nogita: Thermal expansion of Cu6Sn5 and (Cu,Ni)6Sn5. Journal of Material Research, 26, 2660 (2011).
24.Qiuling Wen, Jinhong Chen, Guoqin Huang, Changcai Cui, Dekui Mu: Dependence of Monocrystalline Sapphire Dicing on Crystal Orientation Using Picosecond Laser Bessel Beams, Micromachines, 14（2023）772.
25.Qiuling Wen, Jinhong Chen, Jing Lu, Dekui Mu, Feng Jiang: Effect of target on micromachining of sapphire using laser-induced plasma-assisted ablation, Ceramics International, 45 (2019) 22175–22182.
26.Yueqin Wu, Qijian Rao, James P. Best, Dekui Mu，Xipeng Xu, Han Huang，Superior Room Temperature Compressive Plasticity of Submicron Beta‐Phase Gallium Oxide Single Crystals，Advanced Functional Materials，202207960.
27.Ran Sui, Dekui Mu, Rui Cao, Jinghuan Chang: Kinetic Analysis of Wetting Behavior at High Temperatures, Advances in Colloid and Interface Science, 305 (2022) 102698.
28.Shuiquan Huang, Xuliang Li, Dekui Mu,Changcai Cui, Hui Huang, Han Huang: Polishing performance and mechanism of a water-based nanosuspension using diamond particles and GO nanosheets as additives, Tribology International, 2021.
29.Qi Chen, Rong Hu, Shenbao Jin, Dekui, Gang Sha: Irradiation-induced clustering in a Fe-Mn-Si alloy at different doses and temperatures, Journal of Nuclear Materials, 2021.
30.Yongqiang Wang, Xuliang Li, Yueqin Wu, Dekui Mu, Han Huang: The removal mechanism and force modelling of gallium oxide single crystal in single grit grinding and nanoscratching, International Journal of Mechanical Science, 2021.
31.Han Huang, Xuliang Li, Dekui Mu, Brian R Lawn, Science and Art of ductile grinding of brittle solids, International Journal of Machine Tools and Manufacturing, 161(2021)103675.
32.Jianbin Wang, Qiaoli Lin, Hui Li, Dekui Mu: Wetting of monocrystalline silicon (100) surface by Sn0.3Ag0.7Cu-xTi (x = 1 and 3 wt%) alloys at 800–900 oC, Microelectronics Reliability, 2021.
33.Qiqi He, Yubin Zhang, Duan Nian, Hui Huang, Dekui Mu, Xinjiang Liao*, Wetting behaviours and interfacial characteristics of Co-binder sintered polycrystalline diamond by Sn-Ti active solder, Powder Technology, 376 (2020) 643–651. （第一及通讯作者皆为本人指导研究生）
34.Yueqin Wu, Dekui Mu, Han Huang, Deformation and removal of semiconductor and laser single crystals at extremely small scales, International Journal of Extreme Manufacturing 2(2020)012006.
35.Guoqin Huang, Jierong Huang, Meiqin Zhang, Dekui Mu, Guangtao Zhou, Xipeng Xu: Fundamental aspects of ultrasonic assisted induction brazing of diamond onto 1045 steel, Journal of Materials Processing Technology, 2018.
36.Yafeng Yang, Dekui Mu: Simultaneous dehydrogenation and synthesis of TiB2-TiC through self-propagation high-temperature synthesis from TiH2-B4C powder blends, Metallurgical and Materials Transactions A.
37.Yafeng Yang, Dekui Mu: Effects of Ni additions on the formation of Ti5Si3 prepared by self-propagation high-temperature synthesis. Journal of the European Ceramic Society.
38.Y. F. Yang, Dekui Mu: Dehydrogenation process and its effect on formation mechanism of TiC during self-propagation high-temperature synthesis from TiH2-C. Powder Technology.
39.Y.F. Yang, Dekui Mu, Q.C. Jiang: A simple route to fabricate TiC-TiB2/Ni composite via thermal explosion reaction assisted with external pressure in air. Materials Chemistry and Physics.
40.Kazuhiro Nogita, Dekui Mu, Stuart D. McDonald, Jonathan Read and Yueqin Wu: Effect of Ni on phase stability and thermal expansion of Cu6Sn5 and (Cu,Ni)6Sn5. Intermetallics, 26, 78 (2012).
代表性专利
1.一种芯片划切用多孔质Cu-Sn基超薄砂轮及其制备方法，发明专利，CN202110379041.6。
2.一种芯片划切用多孔质超薄砂轮及其制备方法，发明专利，CN202110379057.7。
3.以碳化钨为基体的金刚石磨头及其钎焊方法，发明专利，CN108544385A，已转让。
4.一种含Cr的低温钎焊金刚石及其钎料合金，发明专利，CN108608345A，已转让。
5.一种钎焊多层金刚石磨头的制样装置，实用新型专利，CN208584427U，已转让。
6.Method for preparing a low-temperature sintering silver paste，美国专利。